SF-Cu - Material

Applus+ Materials Portal

SF-Cu is part of Applus+ Materials Portal, it belongs to Non-Ferrous Wrought Materials, Copper wrought materials, Copper (DIN), it is specified in DIN 1787 : 1973-01. Among others, values can be offered for Elongation A10 [%], Yield Strength (0.2% offset) [MPa], Nominal Size [mm], Elongation A [%], Tensile Strength [MPa], Hardness HB | HBW, Hardness HV, Elongation A100 [%], Grain Size [mm] in a range of (20;20)°C and for Melting Temperature [°C], Young's Modulus [GPa], Thermal Conductivity [W/m*K], Electric Conductivity [MS/m], Mean Specific Heat Capacity [kJ/(kg*K)], Density [g/cm³], Specific Electrical Resistance [µΩm], Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] in a range of (20;300)°C. In addition to this, Fatigue behaviour is offered.

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