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CuNi3Si1 - Material
CuNi3Si1 belongs to group Copper, low-alloyed (EN)
Applus+ Materials Portal
CuNi3Si1 is part of Applus+ Materials Portal, it belongs to Non-Ferrous Wrought Materials, Copper wrought materials, Copper, low-alloyed (EN), it is specified in DIN EN 12165 : 1998-04. Among others, values can be offered for Yield Strength (0.2% offset) [MPa], Nominal Size [mm], Hardness HV, Tensile Strength [MPa], Hardness HB | HBW in a range of (20;20)°C and for Melting Temperature [°C], Thermal Conductivity [W/m*K], Young's Modulus [GPa], Electric Conductivity [MS/m], Density [g/cm³], Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1] in a range of (20;300)°C.
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