Cu-HCP - Material

Applus+ Materials Portal

Cu-HCP is part of Applus+ Materials Portal, it belongs to Non-Ferrous Wrought Materials, Copper wrought materials, Copper (EN), it is specified in DIN EN 1977 : 1998-05. Among others, values can be offered for Nominal Size [mm], Hardness HV, Hardness HB | HBW, Elongation A100 [%], Yield Strength (0.2% offset) [MPa], Elongation A [%], Tensile Strength [MPa], Elongation A50 [%] in a range of (20;20)°C and for Thermal Conductivity [W/m*K], Mean Specific Heat Capacity [kJ/(kg*K)], Density [g/cm³], Mean Coefficient of Thermal Expansion (reference 20°C) [10^-6*K^-1], Young's Modulus [GPa], Electric Conductivity [MS/m], Specific Electrical Resistance [µΩm], Nominal Size [mm], Melting Temperature [°C] in a range of (20;300)°C. In addition to this, Fatigue behaviour is offered.

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